With a Degree in Electrical Engineering, Nick is relied upon to solve problems for high tech clients such as Maxell, Canon, BOE Technology Group (Jingdongfang), and others. Most recently, Nick has supported litigation around various aspects of semiconductor and smartphone technologies, including mesh networks and smart phone manufacturing.
Previously, Nick was a foreign weapons engineer at Dynetics, where he worked on reverse engineering projects. In addition, Nick designed and developed control circuit boards for commercial products.
